Skyworks SKY77621-11 Multimode Multiband Power Amplifier Module IC
£4.19
Condition: New
- Size Guide
Size Guide
Size Chest Waist Hips XS 34 28 34 S 36 30 36 M 38 32 38 L 40 34 40 XL 42 36 42 2XL 44 38 44 All measurements are in INCHES
and may vary a half inch in either direction.
Size Chest Waist Hips 2XS 32 26 32 XS 34 28 34 S 36 30 36 M 38 32 38 L 40 34 40 XL 42 36 42 All measurements are in INCHES
and may vary a half inch in either direction.
Size Chest Waist Hips XS 34 28 34 S 36 30 36 M 38 32 38 L 40 34 40 XL 42 36 42 2XL 44 38 44 All measurements are in INCHES
and may vary a half inch in either direction.
- Delivery & Return
Delivery
We ship worldwide (except batteries). Order will be shipped by shipping method chosen at the checkout. Always free shipping for multiple item orders over ÂŁ200. During holidays and summer periods the delivery time may be longer than normal.Return
Chipbay will accept exchanges and returns of purchased goods within 30 days of the date of purchase (14 days during the sales period). Your return will usually be processed within 1-3 days. We’ll send you a Return Notification email to notify you once the return has been completed. Please allow 1-3 business days for refunds to be received to the original form of payment once the return has been processed.Help
Give us a shout if you have any other questions and/or concerns.
Email: [email protected]
Phone: +44 1733806223
Please note fitting require good skills and equipment.
Item is not refundable if been used, please check chip before fitting.
General Description
Skyworks SKY77621-11 is a hybrid multimode multiband (MMMB) Power Amplifier Module (PAM) that supports 2.5G / 3G / 4G handsets, and operates efficiently in GSM, EGPRS, EDGE, WCDMA, TD-SCDMA, and LTE modes. The module is fully programmable through a MIPI interface.
The PAM consists of a GSM850 / EGSM900 PA block, a DCS1800 / PCS1900 PA block, a WCDMA / LTE block for low and high bands, and a Multi-Function Control (MFC) block, RF input/output ports internally matched to 50 ÂŁ[ to reduce the number of external components. A CMOS integrated circuit, using standard MIPI control, provides the internal MFC interface and operation. Extremely low leakage current maximizes handset standby time.
The InGaP die and the silicon die and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated in a 5 x 7 x 0.9 mm, 42-pad MCM, SMT package which allows for a highly manufacturable, low cost solution
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